OPEN MIND joins Oregon Manufacturing Innovation Center as New Member
30.05.2024 — OPEN MIND Technologies, a leading developer of CAD/CAM software solutions worldwide, has joined the Oregon Manufacturing Innovation Center, Research and Development (OMIC R&D), a leading collaborative in advanced metals manufacturing technologies, as a new member. OPEN MIND’s high-performance CAD/CAM software strategies and OMIC R&D’s wealth of experience in optimizing CAD/CAM solutions that significantly improve programming and manufacturing processes create an exceptional partnership.
OPEN MIND’s hyperMILL® software offers a comprehensive range of 2.5D, 3D, 5-axis milling, and turning strategies, enhancing automated programming, and optimizing production processes globally. A module for advanced tool path planning for Directed Energy Deposition (DED) Additive Manufacturing is also included to support this burgeoning technology, a key focus at OMIC.
“OPEN MIND is pleased to provide hyperMILL® software technology and engineering competence to OMIC R&D to enhance machine performance, and collaborate on member and industry projects”, said Alan Levine, Managing Director of OPEN MIND Technologies USA, Inc. “This collaborative aligns well with high-end applications.”
“OPEN MIND's commitment to innovation and its recognized excellence in CAD/CAM technologies make them an invaluable addition to our membership," said Josh Koch, Business Development Manager at OMIC R&D. "This partnership not only enhances our network but also enriches the resources and expertise available to our partners."
OPEN MIND and OMIC R&D are committed to pushing the boundaries of manufacturing technology and look forward to a productive collaboration that promises to bring innovative solutions to the forefront of the industry.
(L to R) Alan Levine, Managing Director of OPEN MIND Technologies USA, Don Hendrickson, Executive Director of OMIC R&D, and Kevin Lewis, Account Manager at OPEN MIND Technologies USA.
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If so, please contact Jon Elias, Director of Marketing and Communications, at